We invite engineering leaders, researchers, educators, innovators, entrepreneurs, and students to submit their original manuscripts to TEMSCON-ASPAC 2024. Contributions may take the form of academic research or practice-focused papers, to help advance the understanding and the state of practice related to successful technology and engineering management.
Accepted and Presented papers will be submitted for possible inclusion into IEEE Xplore®.
The author must follow the following guidelines for the paper acceptance.
Paper submission guidelines
- All papers are required to be in English language.
- Papers submitted to ASPAC TEMSCON 2024 shall contain original work by the author(s) that have not been published or submitted for publication. The IEEE anti-plagiarism policy is applicable to all submissions.
- Authors are requested to submit a copy of the Turnitin report or any other plagiarism detection tool report indicating a similarity index of less than 20% along with their manuscript during their initial submission for consideration in the review process
- Artificial intelligence (AI)–generated text: The use of content generated by artificial intelligence (AI) in an article (including but not limited to text, figures, images, and code) shall be disclosed in the acknowledgements section of any article submitted to an IEEE conference. The AI system used shall be identified, and specific sections of the article that use AI-generated content shall be identified and accompanied by a brief explanation regarding the level at which the AI system was used to generate the content. The use of AI systems for editing and grammar enhancement is common practice and, as such, is generally outside the intent of the above policy. In this case, disclosure as noted above is recommended.
- The authors are required to use IEEE Standard manuscript template for the conference. The manuscript template can be downloaded from IEEE conference template page. Please click here
- Authors are required to prepare and submit the papers in IEEE standard A4 size two-column conference format. The paper must be a maximum of 8 pages in length including diagrams, pictures and references.
- Choose one topic related to the paper. This information will be used by committee for assigning appropriate reviewers.
- The introduction of paper shall clearly indicate the unique aspect of submission
- The papers must be uploaded in PDF format.
- Changes can be made even after submission till the deadline. No submissions will be accepted after the submission deadline.
Review and acceptance
- All papers will be peer reviewed.
- English shall be official language.
- Paper must not exceed
8 pages. Failing to do so may result in rejection. - Acceptance is based on condition that at least one author will register and present the paper at conference. IEEE reserves rights to exclude a paper from distribution after the conference if the paper is not presented at the conference.
Presentation guidelines
- The presentation should be in
English. - Presentations should use ASPAC TEMSCON 2024 Cover Template <<download>>.
- Authors should submit their PPT file to this Google Drive Folder <<link>> before the presentation.
- Presentation discussion should be in English.
- Presentation should not exceed 12 to 15 minutes.
- 3 to 5 minutes will be given for Q&A.
Important note to authors
- In case of multiple authors for an accepted paper, at least one author is expected to attend the meeting.
- Registration fee must be paid within the due deadline. Late payment may result in the paper not being included in the conference program and any other publications that are produced for distribution at conference.
- Each paid fee covers one presentation and an additional registration fee applies for any extra presentation.
- Participation will be confirmed upon receipt of the online registration form and fee payment.
- Per ASPAC TEMSCON no show policy, the program chair reserves the right to exclude any unpresented papers from proceeding to IEEE Xplore©.
Contact
- temsconaspac2024@gmail.com
- Connect to our Linkedin Page for updated Information
TEMSCON Special Issue Opportunity in IEEE Journal
IEEE Transactions on Engineering Management (IEEE-TEM)
(Scopus SJR : Q1) (WoS-Indexed | JCR 2022 IF: 5.8)
- IEEE TEMS Publications encourages authors of conference papers to submit extended versions of their work to TEMS publications.
- We are pleased to invite authors of presented papers at 2024 IEEE TEMSCON-LATAM & 2024 IEEE TEMSCON-ASPAC to submit their extended papers.
- We also welcome direct submissions to a Special Issue in IEEE Transactions on Engineering Management: “Technology and Engineering Management for Sustainable and Competitive Societies in the Age of AI”
- For more information, click here.
Contact Us:
temsconaspac2024@gmail.com
Connect to our Linkedin Page for updated Information
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